Experience ultra-fast data transfer at 4.8Gbps with USB 3.0 – the latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.0 transfers data 10x faster and is also backward compatible with USB 2.0 components.

With its fast user-friendly interface, ASUS AI Suite II consolidates all the exclusive ASUS features into one simple to use software package. It allows you to supervise overclocking, energy management, fan speed control, voltage and sensor readings. This all-in-one software offers diverse and ease to use functions, with no need to switch back and forth between different utilities.

Tap into the world’s first real time PC power saving engine through AI Suite II utility. Get total system power savings by automatically detecting current PC loadings and intelligently moderating power consumption. This also reduces fan noise and extends component longevity.

The motherboard supports DDR3 memory that features data transfer rates of 1333 / 1066 MHz to meet the higher bandwidth requirements of the latest 3D graphics, multimedia, and Internet applications. The dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost system performance.

P8H67-M PRO brings you the multi-GPU choice of ATI Quad-GPU CrossFireX. The motherboard features the most powerful Intel H67 platform to optimize PCIe allocation in multiple GPU configurations. Expect a brand-new gaming style you’ve never experienced before!

The motherboard’s powerful Intel® H67 platform optimizes PCIe allocation in multiple-GPU configurations of CrossFireX™. This allows you to enjoy a never before-experienced brand new gaming style.

The motherboard’s powerful Intel® P67 platform optimizes PCIe allocation in multiple-GPU configurations of CrossFireX™. This allows you to enjoy a never before-experienced brand new gaming style.

The world’s first Dual Intelligent Processors from ASUS pioneered the use of two onboard chips - EPU (Energy Processing Unit) and TPU (TurboV Processing Unit). New generation Dual Intelligent Processors 2 with DIGI+ VRM digital power design launch control into a new era.

Unleash your performance with ASUS' simple onboard switch or AI Suite II utility. The TPU chip offers precise voltage control and advanced monitoring through Auto Tuning and TurboV functions. Auto Tuning offers a user friendly way to automatically optimize the system for fast, yet stable clock speeds, while TurboV enables unlimited freedom to adjust CPU frequencies and ratios for optimized performance in diverse situations.

The TUF Thermal Armor is the world’s first ever thermal design for the entire motherboard, not just for select critical areas. It safeguards the system against hot air generated by connected cards and components, keeping temps down. With its sophisticated and agile integrated shunt design, the Thermal Armor improves cool air circulation, directing it towards every important part for a complete motherboard cool down. It effectively conducts hot air away and out of the case through special airflow channels, contributing to enhanced system stability and extending component lifespan.

The digital architecture delivers twice the precision power, intelligently adjusting PWM voltage and frequency modulation with minimal power loss through BIOS tuning and an exclusive user interface to increase the board’s overclocking range while performance reaches its full potential. It also adjusts VRM frequencies dynamically, cutting radiation interference by half and decreasing Vcore power noise for CPU to enhance system stability through enabling VRM spread spectrum. ASUS DIGI+ VRM digital power design empowers users with superior flexibility and perfect precision to ensure optimized performance, extreme system stability and greater power efficiency.

High quality materials and components include all Japan-made ultra long life solid state capacitors and very low resistance (Rds) MOSFETS. These go far beyond the standards employed by mainstream P67-based motherboards. As a result, users benefit from improved heat dissipation, lower capacitance (and thus greatly improved efficiency), optimized gate charge and extremely long component life cycles.

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